| ● XT H 225 Industrial CT Scanning |
| ● XT H 450 for CT Inspection of Blades and Castings
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| ● XT V 130 Electronics X-ray Inspection |
| ● XT V 160 Electronics X-ray Inspection
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| XT H 225 Industrial CT Scanning
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 Full inner and outer inspection of industrial components
Detailed capture and measurement of internal component and assembly features is often vital for quality control, failure analysis and material research. XT H 225 offers a powerful micro-focus X-ray source, a large inspection volume, and high X-ray and CT imaging resolution. XT H 225 suits a wide range of applications, including inspection of small castings, plastic parts as well as material research.
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| Features
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Powerful 225kV micro-focus source with optional rotating target
Real-time X-ray visualization, fast CT reconstruction
CT measuring volume up to ø250mm and 600mm height
5-axis fully programmable part manipulator
Customizable macros automate measurement workflow
Small footprint and castors & roller for easy handling
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| Applications
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Evaluation and measurement of precision plastic parts and small castings, complex mechanisms, internal components, part-to-CAD comparison, etc.
Detailed failure analysis
Advanced material research and analysis of biological structures
Digital archiving of models
Troubleshooting of assembly issues
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| Benefits |
Flexibility combined in a single system: X-ray for quick visual inspection, CT for in-depth analysis
Fast data capture and high-quality images
Fast operation with interactive joystick navigation
High-resolution digital imaging and processing
Safe system requiring no special precautions or badges
Tight integration with industry standard post-processing applications
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| Related solutions |
XT H LC (Large Cabinet)
Inspect-X software
Focus Inspection software
A wide range of customer-specific CT configurations can be provided
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| XT H 450 for CT Inspection of Blades and Castings
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High power 450kV micro-focus source
The XT H 450 LC sets a new reference for turbine blade measurement and NDT of small to medium castings. At the core of this powerful equipment is a 450kV micro-focus source, providing superior resolution and accuracy.
The curved linear array detector optimizes the collection of X-rays by eliminating scatter phenomena that typically corrupt 2D radiographs of blades and other metal parts.
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| Features
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Unique 450kV micro-focus source
Measuring volume up to 600mm diameter and 600mm height
High efficiency linear detector
5-axis fully programmable turntable manipulator with precision ball screws and linear slides
Dedicated application for automatic pass/fail inspection of turbine blades
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| Applications
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Detailed analysis of the internal structure of turbine blades
Automated pass/fail inspection of blades
Inspection of high density parts (e.g metal parts, castings) with a need for micron accuracy
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| Benefits
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Flexibility combined in a single system: X-ray for quick visual inspection, CT for in-depth analysis
Fast data capture and high-quality images
High-resolution digital imaging and processing
Safe system requiring no special precautions or badges
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| Related solutions
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XT H 225
A wide range of customer-specific CT configurations can be provided
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| XT V 130 Electronics X-ray Inspection
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Compact, versatile and easy-to-use electronics QA system
With the advent of many newer type of electronic components, surface inspection is no longer an option. As most electrical connections remain hidden for the eye, the ability to run premium quality real-time X-ray is more important than ever before. Designed for 100% (μ)BGA, multi-layer and PCB solder joint inspection, the XT V 130 X-ray system is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. The system's Inspect-X software offers automated inspection functions and (optional) automatic board identification, which ensure high inspection throughput rates.
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| Features
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Proprietary micro-focus source with 3 micron focal spot size
High, 16-bit resolution imaging and image processing tools
Large tray for loading multiple boards
Optional rotation table (360° continuous)
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| Applications
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Electronic and electrical components
- Broken wedge bonds, lifted ball bonds, wire sweep, die attach, dry joints, bridging/shorts, voiding, BGA, etc.
Populated and unpopulated PCBs
- View surface mount defects i.e. misaligned devices, solder joint porosity and bridging
- Detailed inspection of vias, through-hole plating and multi-layer alignment
- Wafer-level chip scale packages (WLCSP)
- BGA and CSP inspection
- Non-lead solder inspection
Micro-electro-mechanical systems (MEMS, MOEMS)
Cables, harnesses, plastics and many more
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| Benefits
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X-ray inspection workhorse for electronics quality assurance
Macro-based automation requires no programming skills
Component-specific automated pass/fail analysis, off-line visualization station and automatic report generation
Ready to automate complex tasks with VBA
On-line operation with intuitive joystick navigation
Low-cost maintenance with open-tube technology
Safe system requiring no special precautions or batches
Small footprint and low-weight for easy installation
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| Related solutions
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XT V 160
Inspect-X
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| XT V 160 Electronics X-ray Inspection
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Top-class inspection system for miniaturized electronic components
Component connections on today’s compact and densely populated PCBs are hidden by other components, making X-ray the only viable inspection solution. XT V 160 is an easy-to-use, cost-effective and high-quality PCB inspection system targeting production facilities and failure analysis laboratories.
In automated inspection mode, samples can be inspected at the highest throughput. In manual mode, intuitive software and high-precision sample manipulation enable operators to visualize and evaluate the tiniest internal defects and deficiencies.
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| Features
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NanoTechTM source with submicron focal spot size
Fast data capture and high-quality imaging
Large tray for loading multiple boards
Customizable macros automate measurement workflow
Remote validation station available
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| Applications
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Solder reflow analysis
BGA connectivity and analysis
Solder void calculation
Through hole measurement and inspection
Die attach voiding measurement
Ball bond analysis
Stitch bond analysis
Micro BGA / chip on chop analysis
Pad array analysis
Dry joint detection and analysis
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| Benefits
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Flexibility combined in one system
- Interactive visualization
- Fully automatic X-ray inspection
- Optional CT for in-depth analysis
Fast operation with intuitive GUI and interactive joystick navigation
Low-cost maintenance with open-tube technology
Safe system requiring no special precautions or badges
Small footprint
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| Related solutions
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XT V 130
Inspect-X
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