| ● NEXIV VMR-H3030 Ultrahigh-precision Type |
| ● NEXIV VMR-H3030 Z120X Ultrahigh-precision Type with Maximum Magnification Module |
| ● NEXIV VMR-3020 Standard Type |
| ● NEXIV VMR-3020 Z120X Standard Type with Maximum Magnification Module
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| ● NEXIV VMR-6555 Large Stroke Type |
| ● NEXIV VMR-6555 Z120X Large Stroke Type with Maximum Magnification Module
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| ● NEXIV VMR-10080 Ultra-large Stroke Type |
| ● NEXIV VMR-10080 Z120X Ultra-large Stroke Type with Maximum Magnification Module
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| ● NEXIV VMR-3020 with Wafer Loader NWL860T |
| ● NWT-3000 (for VMR-K3040ZC)
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| ● Confocal NEXIV VMZ-K6555/ VMZ-K3040
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| ● Wafer Carrier Measuring System NEXIV VMR-C4540
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| ● Digital Imaging and Metrology iNEXIV VMA-2520
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| NEXIV VMR-H3030
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| With ultrahigh precision and versatility, this model can serve as the master instrument in your laboratory. Ideal for high-precision dies and molds.
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| Applications
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 Master instrument in a laboratory
Dies and molds
Finely machined parts
- Ultrahigh precision appropriate for the master instrument
- Wide illumination choices ensure accurate detection of edges in dies and molds
- Long working distance (50mm) permits measurements of parts with big height gaps
- 15X zoom provides universal applications while facilitating easy search at low magnifications and
accurate measurements at high magnifications
- User-friendly software
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| Measurement Examples |
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| NEXIV VMR-H3030 Z120X
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| With an ultrahigh-precision stage and maximum magnification module, it measures fine workpieces with ultrahigh accuracy (e.g., critical dimensions on patterned masks and bump heights)
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| Applications
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Wafer level CSP
Wafer level bump heights
Wafer level SIP
Rerouted masks
Masks for MEMS
- 120X optical magnification enables measurements of rerouted patterns on wafer level CSP
- High precision stage facilitates accurate measurements even for wider dimensions
- Enables measurements of top and bottom widths of etched lines, respectively
- Laser AF facilitates measurements of minuscule bump heights
- Enables evaluation of cross-sectional shapes of bumps and solder balls
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| Measurement Examples
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| NEXIV VMR-3020
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| The standard model of the NEXIV series. It handles a variety of measurement tasks including those for mechanical parts, molded parts, stamped parts and various other workpieces.
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| Applications
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Semiconductor packages
Substrates
Stamped parts
Connectors
Injection molded parts
- Variety of illumination choices facilitate accurate detection of edges in molded parts
- Long working distance (50mm) permits measurements of parts with big height gaps
- 15X zoom provides universal applications while facilitating easy search at low magnifications and accurate
measurements at
high magnifications - User-friendly software - Laser AF facilitates evaluations of
cross-sectional shapes and 3D profiling as well as the flatness of workpiece surfaces
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| Measurement Examples
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| NEXIV VMR-3020 Z120X
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| Its maximum magnification module achieves measurements of fine workpieces. Perfect for measurements of topical MEMS parts, high-density PCBs and semiconductor packages.
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| Applications
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High-density PCBs
Exposure masks for substrates
Packages (2D + height)
MEMS parts
- Maximum magnification module and high-precision stage enable accurate measurements of
large geometry workpieces and minute shapes
- Laser AF with minute laser spots provides accurate measurements of small cross-sectional shapes
- Optional surface analysis software displays 3D shapes of MEMS parts
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| Measurement Examples
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| NEXIV VMR-6555 Large Stroke Type
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| High-speed measurements with a large stroke stage. Optimal for measurements of PCB patterns and external dimensions of a display panel.
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| Applications
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Semiconductor packages (multiple pieces)
Substrates
Printing masks for substrates
Stamped parts (multiple pieces)
Connectors (multiple pieces)
Injection molded parts (multiple pieces)
Injection molded parts
650 x 550 mm stage stroke perfect for PCBs
- Automatic measurements of small parts by placing multiple pieces together on the stage
- Laser AF achieves high-accuracy measurements of bump heights
- Laser AF also enables measurements of height gaps and warping in workpieces
- Search function enables
measurements of lands and holes of PCBs
- Search function also provides accurate measurements even when workpieces are not located properly
on the stage
- Variety of illumination choices facilitate accurate edge detection even for vague geometries
- High-speed stage and high-speed image processing provide high throughput
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| Measurement Examples
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| NEXIV VMR-6555 Z120X
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| Amazing 120X zoom combined with a big stage enables ultrahigh magnification measurements on big workpieces. Ideal for measuring high-density PCBs and their masks.
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| Applications
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High-density PCBs
Exposure masks for substrates
Semiconductor packages (multiple pieces; 2D + height)
Photo plotter machines for masks
- Amazing 120X zoom - Enables measurements of 1µm linewidths at the maximum magnification - Laser AF perfect for measuring minuscule, complicated geometries - High-speed stage and high-speed image processing provide high throughput
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| Measurement Examples
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| NEXIV VMR-10080
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| Long 1000 x 800 mm stage stroke provides maximum performance in the measurement of large-size workpieces such as FPD devices.
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| Applications
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Printing masks for substrates
Mother substrates for PCBs
Shadow masks
FPD devices
- Long stage stroke enables measurements of LCD substrates/modules and large-size PCBs
- Laser AF also enables measurements of height gaps and warping in workpieces
- Search function enables measurements of lands and holes of PCBs
- Variety of illumination choices facilitate accurate edge detection even for vague geometries
- High-speed stage and high-speed image processing provide high throughput
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| Measurement Examples
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| NEXIV VMR-10080 Z120X
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The model achieves ultrahigh magnification measurements with a long 1000 x 800mm stage stroke.
Ideal for measuring minute linewidths of large-size display
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| Applications
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LCD glass substrates (pattern measurements)
Organic EL glass substrates (pattern measurements)
- Automatic measurements of small parts by placing multiple pieces together on the stage
- Laser AF achieves high-accuracy measurements of bump heights
- Laser AF also enables measurements of height gaps and warping in workpieces
- Search function enables measurements of lands and holes of PCBs
- Search function also provides accurate measurements even when workpieces are not located properly on
the stage
- Variety of illumination choices facilitate accurate edge detection even for vague geometries
- High-speed stage and high-speed image processing provide high throughput
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| Measurement Examples
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| NEXIV VMR-3020 with Wafer Loader NWL860T
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| With a wafer loading/unloading system, this system measures the whole contents of a wafer carrier automatically.
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Dedicated software provides fully automatic carrier-by-carrier measurements
User-friendly GUI facilitates the selection of wafers to be measured
Wafer map facilitates the selection of chips to be measured
Industry-proven NWL860T wafer loader ensures reliable wafer transport
In combination with the VMR-3020 Z120X, it can measure minuscule dimensions on wafers
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| NWT-3000 (for VMR-K3040ZC)
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The system moves wafers between the FOUP and the VMR-C4540 based on the recipe that you will create.
Wafers can be put on the stage to measure by an operator.
(200mm and 150mm wafers can be measured only in case of this.)
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| Confocal NEXIV VMZ-K6555/ VMZ-K3040
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The Confocal NEXIV, a ground-breaking Multi-Functional video measuring system, was developed on the strength of Nikon's leading opto-mechatronics technologies.
It incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements you need–two-dimensional or three-dimensional–inspection and evaluation is exceptionally fast and accurate with this system! The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.
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| Features
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Simultaneous wide-area height measurements with Nikon proprietary confocal optics
2D measurement with 15x brightfield zoom optics
fully compatible with 300mm wafer measurement at semiconductor fabs
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| Applications
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IC Packages
Flip Chip/COF(Bump)/COG
CSP (FBGA)/SIP (Bump, Wire)
Interposer (Pad height)
MEMS
Probe Card (Silicon Probe, Au Probe)
Precise Glass Components (Micro Lens, Contact Lens)
Photo Spacer Width/Height for Color Filter for FPD Panel
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| Measurement Examples
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| Wafer Carrier Measuring System NEXIV VMR-C4540
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Non-contact, fully automatic measurement provides outstanding throughput.
Perfect for measuring FOUP and FOSB.
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Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments
SEMI-compliant kinematic plate provides perfect XYZ coordinates
Variety of illumination choices facilitate accurate measurements of registration pin holes and latch-key holes
Laser AF provides fast, non-contact measurements of wafer positions
Wide area, high-intensity LED illumination enables accurate measurements of wafer heights
300mm, 200mm wafer carrier and SMIF Pod base
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| Digital Imaging and Metrology iNEXIV VMA-2520
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Designed to meet the automated metrology requirements of mechanical parts, electronic devices, dies & molds and medical devices
The new iNEXIV VMA-2520 has been expressly designed for three-dimensional workpieces. Though compact and lightweight in design, it provides a long 200mm Z-axis stroke and a 73.5mm working distance, enabling easy Z-axis measurement of mechanical parts, plastic injection molding parts, metal press parts, electronic devices, dies & molds and medical devices. The standard 10x zoom optics meets the industry's demanding needs for superb resolution at high magnifications while offering a wide field of view at low magnifications. Low distortion optics and high intensity white LED illumination sources improve contrast to enhance throughput. This combination assures reproducible measurements even for colorful parts.
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| Main features
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Easy and accurate measurements optimized for 3D parts
- Nikon has drawn on its state-of-the-art digital technologies to produce a highly affordable automated measurement system. The iNEXIV VMA-2520's design is optimized for easy use as well as repeatable and accurate measurement of 3D parts.
Compact and lightweight
- The iNEXIV VMA-2520 is a powerful bench top system designed to use minimum factory floor space. The main body has a footprint of only 565mm W x 690mm D x 740mm H (computer and controller separate) and weighs only 72kg (158.7 lb), yet it still has a 250mm x 200mm x 200mm measuring capability.
Long working distance
- The newly developed optical system features a super long 73.5mm working distance for all magnifications. This allows sufficient three dimensional clearance for Z-axis measurements even at high magnification.
Sophisticated VMA AutoMeasure software
- This new versatile software has been developed exclusively for the VMA-2520. It provides various functions to easily conduct tasks ranging from setup, teaching programs and measurements, to evaluations.
High-speed, highly-accurate Laser AF (optional)
- In addition to the standard Vision AF, an optional high-speed Laser AF with a long 63mm working distance is available. It provides fast focusing and Z-axis measurements regardless of the surface shape of your workpiece.
Touch probing measurement (optional)
- The iNEXIV VMA-2520 accepts the Renishaw TP20 system, making 3D parts measurement much easier.
- Touch Probing Option will be available in 2007 summer.
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| Measurement Examples
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